Intro
In the world of electronic manufacturing, ensuring the quality of through-hole solder joints is crucial for product reliability. Traditional inspection methods often struggle to reveal internal solder filling conditions without destructive testing. This is where the Wellman X6800 X-ray inspection system steps in, providing a powerful, non-destructive solution for evaluating solder fill rates with precision.
The Challenge of Through-Hole Inspection
Through-hole technology (THT) remains widely used in high-reliability electronics such as automotive, aerospace, and industrial controls. However, ensuring complete and proper solder filling in plated through-holes (PTH) can be difficult. Insufficient solder fill may lead to poor electrical connectivity, mechanical weakness, or early failure in the field.
Typical 2D X-ray systems capture a flat image, which sometimes makes it challenging to distinguish solder fill issues, especially when multiple layers overlap or when the board has complex structures. Accurate measurement of solder filling percentage demands a more sophisticated approach.
The X6800 Advantage: Flat Panel Tilt Function
The Wellman X6800 is equipped with an innovative flat panel tilt function, enabling the X-ray detector to tilt at various angles during inspection. This unique feature allows the system to capture oblique images of the through-hole from different perspectives, greatly enhancing the visibility of the internal structure.
By tilting the flat panel, the X6800 can effectively “look into” the through-hole at an angle, revealing:
The depth and consistency of the solder
The presence of any voids or gaps
The completeness of the wetting process
The exact solder fill rate (%)
This oblique viewing capability overcomes the limitations of traditional 2D imaging and provides a much clearer, quantifiable view of the solder’s coverage inside the barrel.
How X6800 Measures Solder Filling
The inspection process typically involves the following steps:
Positioning: The PCB is aligned so that the through-hole is centered in the X-ray field of view.
Tilting: The flat panel detector is tilted at optimized angles (e.g., 30° to 60°) to capture cross-sectional-like images.
Imaging: High-resolution images are taken at different tilt angles to analyze the solder profile.
Analysis: Using Wellman’s image processing software, the system measures the length of the soldered area against the full length of the through-hole, calculating the solder fill rate as a percentage.
This method provides highly accurate, repeatable measurements without damaging the board, making it ideal for both quality control and process optimization.
Why Solder Fill Rate Matters
Industry standards like IPC-A-610 specify minimum acceptable solder fill rates (typically 75%–100% depending on the class of the assembly). With the X6800, manufacturers can ensure compliance with these standards, improve product reliability, and reduce the risk of costly field failures.
Conclusie
With its advanced flat panel tilt capability, the Wellman X6800 sets a new standard for through-hole solder inspection. It provides clear, detailed, and quantitative analysis of solder fill rates, helping manufacturers maintain the highest levels of quality and reliability in their products.
If you are looking to enhance your PCBA inspection process and gain deeper insight into through-hole quality, the Wellman X6800 is the solution you can trust.
